TGA1055 查看數據表（PDF） - TriQuint Semiconductor

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TGA1055

Ka Band 2 Watt Power Amplifier

TriQuint Semiconductor 

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Reflow process assembly notes:

Chip Assembly and Bonding Diagram

• AuSn (80/20) solder with limited exposure to temperatures at or above 300♣C

• alloy station or conveyor furnace with reducing atmosphere

• no fluxes should be utilized

• coefficient of thermal expansion matching is critical for long-term reliability

• storage in dry nitrogen atmosphere

Component placement and adhesive attachment assembly notes:

• vacuum pencils and/or vacuum collets preferred method of pick up

• avoidance of air bridges during placement

• force impact critical during auto placement

• organic attachment can be used in low-power applications

• curing should be done in a convection oven; proper exhaust is a safety concern

• microwave or radiant curing should not be used because of differential heating

• coefficient of thermal expansion matching is critical

Interconnect process assembly notes:

• thermosonic ball bonding is the preferred interconnect technique

• force, time, and ultrasonics are critical parameters

• aluminum wire should not be used

• discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire

• maximum stage temperature: 200♣C

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

TriQuint Semiconductor Texas : Phone (972)994 8465 Fax (972)994 8504 Web: www.triquint.com

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