TGA1172-SCC(2001) 查看數據表（PDF） - TriQuint Semiconductor
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TGA1172-SCC Datasheet PDF : 8 Pages
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Product Datasheet
April 11, 2001
TGA1172-SCC
Vd
Rf in
5mil
Ribbon
100pF
0.01µF
5mil
Ribbon
Rf out
100pF
0.01µF
Vg
Chip Assembly and Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
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