Not Recommended for New Designs
Product Datasheet
September 26, 2002
TriQuint Recommends the TGA4509-EPU be used for New Designs
TGA1172-SCC
Vd
Rf in
5mil
Ribbon
100pF
0.01mF
5mil
Ribbon
Rf out
100pF
0.01mF
Vg
Chip Assembly and Bonding Diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
TriQuint Semiconductor Texas : Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
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