TGA4505(2005) 查看數據表（PDF） - TriQuint Semiconductor
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TGA4505 Datasheet PDF : 9 Pages
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Advance Product Information
July 22, 2005
TGA4505-EPU
Recommended Chip Assembly & Bonding Diagram
Both-Sided Biasing Option
9G9G
9G
XI
XI
SI
SI
SI
SI
SI
SI
XI
XI
9J9J9J
9G
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
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TriQuint Semiconductor Texas Phone: (972)994-8465 Fax: (972)994 8504 Email: info-mmw@tqs.com Web: www.triquint.com
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