TGA4505 查看數據表（PDF） - TriQuint Semiconductor

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产品描述 (功能)

比赛名单

TGA4505

4 Watt Ka Band HPA

TriQuint Semiconductor 

TGA4505

Recommended Chip Assembly & Bonding Diagram

Both-Sided Biasing Option

Vd1/Vd2

Vd3

.01uf

.01uf

100pf

100pf

100pf

100pf

100pf

100pf

.01uf

.01uf

Vg1/Vg2/Vg3

Vd3

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

8

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