TGA4530 查看數據表（PDF） - TriQuint Semiconductor

零件编号

产品描述 (功能)

比赛名单

TGA4530

K Band High Linearity Power Amplifier

TriQuint Semiconductor 

Mechanical Drawing

1.448

(0.057)

1.353

(0.053)

1.278

(0.050)

0.095

(0.004)

0.547

(0.022)

1.385

(0.055)

TGA4530

2.345

(0.092)

1.363

(0.054)

0.371

(0.015)

0.095

(0.004)

0

0 0.086

(0.003)

1.385

(0.055)

0.256

(0.010)

2.335 2.430

(0.092) (0.096)

Units: Millimeters (inches)

Thickness: 0.10 (0.004)

Chip edge to bond pad dimensions are shown to center of bond pad

Chip size tolerance: +/- 0.05 (0.002)

GND IS BACKSIDE OF MMIC

Bond pad # 1

Bond pad # 2

Bond pad # 3

Bond pad # 4

Bond pad # 5

Bond pad # 6

Bond pad # 7

(RF Input)

(Vg)

(Vd)

(Vdet)

(RF Out)

(Vd)

(Vref)

0.100 x 0.150 (0.004 x 0.006)

0.100 x 0.100 (0.004 x 0.004)

0.150 x 0.100 (0.006 x 0.004)

0.081 x 0.081 (0.003 x 0.003)

0.100 x 0.150 (0.004 x 0.006)

0.150 x 0.100 (0.006 x 0.004)

0.081 x 0.081 (0.003 x 0.003)

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

9

TriQuint Semiconductor: www.triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com Web: www.triquint.com

Oct 2008 © Rev A

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