TMP87CH40 查看數據表（PDF） - Toshiba

零件编号

产品描述 (功能)

比赛名单

TMP87CH40

Original CMOS 8-Bit Microcontroller

Toshiba 

TMP87C840/C40/H40/K40A/M40A

1. Part number

2. Package code and dimensions

Previous Part Number Previous Package Code

(in Body Text)

(in Body Text)

New Part Number

New Package Code

OTP

TMP87C840N

TMP87C840F

TMP87CC40N

TMP87CC40F

TMP87CH40N

TMP87CH40F

TMP87CK40AN

TMP87CK40AF

TMP87CM40AN

TMP87CM40AF

SDIP64-P-750-1.78

QFP64-P-1420-1.00A

SDIP64-P-750-1.78

QFP64-P-1420-1.00A

SDIP64-P-750-1.78

QFP64-P-1420-1.00A

SDIP64-P-750-1.78

QFP64-P-1420-1.00A

SDIP64-P-750-1.78

QFP64-P-1420-1.00A

TMP87C840NG

TMP87C840FG

TMP87CC40NG

TMP87CC40FG

TMP87CH40NG

TMP87CH40FG

TMP87CK40ANG

TMP87CK40AFG

TMP87CM40ANG

TMP87CM40AFG

SDIP64-P-750-1.78

QFP64-P-1420-1.00A

SDIP64-P-750-1.78

QFP64-P-1420-1.00A

SDIP64-P-750-1.78

QFP64-P-1420-1.00A

SDIP64-P-750-1.78

QFP64-P-1420-1.00A

SDIP64-P-750-1.78

QFP64-P-1420-1.00A

TMP87PH40ANG

TMP87PH40AFG

TMP87PH40ANG

TMP87PH40AFG

TMP87PH40ANG

TMP87PH40AFG

TMP87PM40ANG

TMP87PM40AFG

TMP87PM40ANG

TMP87PM40AFG

*: For the dimensions of the new package, see the attached Package Dimensions diagram.

3. Addition of notes on lead solderability

The following solderability test is conducted on the new device.

Lead solderability of Pb-free devices (with the G suffix)

Test

Solderability

Test Conditions

(1) Use of Lead (Pb)

·solder bath temperature = 230°C

·dipping time = 5 seconds

·the number of times = once

·use of R-type flux

(2) Use of Lead (Pb)-Free

·solder bath temperature = 245°C

·dipping time = 5 seconds

·the number of times = once

·use of R-type flux

Remark

Leads with over 95% solder coverage

till lead forming are acceptable.

II

2008-03-06

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