UPC3018 查看數據表（PDF） - NEC => Renesas Technology
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UPC3018
NEC => Renesas Technology
UPC3018 Datasheet PDF : 12 Pages
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µPC3018, 3025
RECOMMENDED SOLDERING CONDITIONS
The µPC3018, 3025 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact our sales representative.
Type of Surface Mount Device
µPC3018TJ, µPC3025TJ: MP-3Z (5 pin)
Process
Conditions
Infrared Ray Reflow
Peak temperature: 235°C,
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 times or less.
Vapor Phase Soldering
Peak temperature: 215°C,
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 3 times or less.
Wave Soldering
Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C MAX. (Package surface temperature).
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
Symbol
IR35-00-3
VP15-00-3
WS60-00-1
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Remark It is recommended to use a rosin-type flux with a low chlorine element (chlorine: 0.2 Wt% or less).
Type of Through-hole Device
µPC3018HB, µPC3025HB: MP-3 (5 pin)
Process
Conditions
Wave Soldering
(only to leads)
Solder temperature: 260°C or below,
Flow time: 10 seconds or less
Partial Heating Method
Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that
the package body does not get jet soldered.
10
Data Sheet G15506EJ2V0DS
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