25Q32DWFIG 查看數據表（PDF） - Winbond

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25Q32DWFIG

1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

Winbond 

W25Q32DW

10.2.41 Disable QPI (FFh).............................................................................................................66

10.2.42 Enable Reset (66h) and Reset (99h)................................................................................67

11. ELECTRICAL CHARACTERISTICS............................................................................................... 68

11.1 Absolute Maximum Ratings................................................................................................ 68

11.2 Operating Ranges............................................................................................................... 68

11.3 Power-Up Power-Down Timing and Requirements............................................................ 69

11.4 DC Electrical Characteristics .............................................................................................. 70

11.5 AC Measurement Conditions.............................................................................................. 71

11.6 AC Electrical Characteristics .............................................................................................. 72

11.7 AC Electrical Characteristics (cont’d) ................................................................................. 73

11.8 Serial Output Timing........................................................................................................... 74

11.9 Serial Input Timing.............................................................................................................. 74

11.10 Hold Timing ....................................................................................................................... 74

12. PACKAGE SPECIFICATION .......................................................................................................... 75

12.1 8-Pin SOIC 208-mil (Package Code SS)............................................................................ 75

12.2 8-Contact 6x5mm WSON (Package Code ZP) .................................................................. 76

12.3 8-Contact 8x6mm WSON (Package Code ZE) .................................................................. 78

12.4 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 79

13. ORDERING INFORMATION .......................................................................................................... 80

13.1 Valid Part Numbers and Top Side Marking ........................................................................ 81

14. REVISION HISTORY...................................................................................................................... 82

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