25Q16DWFIG(2011) 查看數據表（PDF） - Winbond

零件编号

产品描述 (功能)

比赛名单

25Q16DWFIG
(Rev.:2011)

1.8V 16M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

Winbond 

W25Q16DW

3. PIN CONFIGURATION SOIC 150 / 208-MIL

/CS

DO (IO1)

/WP (IO2)

GND

1

8

2

7

3

6

4

5

VCC

/HOLD (IO3)

CLK

DI (IO0)

Figure 1a. W25Q16DW Pin Assignments, 8-pin SOIC 150 / 208-mil (Package Code SN & SS)

4. PAD CONFIGURATION WSON 6X5-MM

/CS

1

DO (IO1)

2

/WP (IO2)

3

GND

4

8

VCC

7

/HOLD (IO3)

6

CLK

5

DI (IO0)

Figure 1b. W25Q16DW Pad Assignments, 8-pad WSON 6x5-mm (Package Code ZP)

5. PIN DESCRIPTION SOIC 150/208-MIL, WSON 6X5-MM

PIN NO.

1

2

3

4

5

6

7

8

PIN NAME

/CS

DO (IO1)

/WP (IO2)

GND

DI (IO0)

CLK

/HOLD (IO3)

VCC

I/O

FUNCTION

I

Chip Select Input

I/O

Data Output (Data Input Output 1)*1

I/O

Write Protect Input ( Data Input Output 2)*2

Ground

I/O

Data Input (Data Input Output 0)*1

I

Serial Clock Input

I/O

Hold Input (Data Input Output 3)*2

Power Supply

*1 IO0 and IO1 are used for Standard and Dual SPI instructions

*2 IO0 – IO3 are used for Quad SPI/QPI instructions

-6-

Share Link: