25Q16DWFIG 查看數據表（PDF） - Winbond
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25Q16DWFIG Datasheet PDF : 84 Pages
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W25Q16DW
3. PACKAGE TYPES AND PIN CONFIGURATIONS
3.1 Pin Configuration SOIC 150 / 208-mil
Top View
/CS
1
8
DO (IO1)
/WP (IO2)
GND
2
7
3
6
4
5
VCC
/HOLD (IO3)
CLK
DI (IO0)
Figure 1a. W25Q16DW Pin Assignments, 8-pin SOIC 150 / 208-mil (Package Code SN & SS)
3.2 Pad Configuration WSON 6x5-mm, USON 4x3-mm
Top View
/CS
18
VCC
DO (IO1)
/WP (IO2)
GND
27
36
45
/HOLD (IO3)
CLK
DI (IO0)
Figure 1b. W25Q16DW Pad Assignments, 8-pad WSON 6x5-mm, USON 4x3-mm (Package Code ZP & UU)
3.3 Pin Description SOIC 150 / 208-mil, WSON 6x5-mm, USON 4x3-mm
PIN NO.
1
2
3
4
5
6
7
8
PIN NAME
/CS
DO (IO1)
/WP (IO2)
GND
DI (IO0)
CLK
/HOLD (IO3)
VCC
I/O
FUNCTION
I
Chip Select Input
I/O
Data Output (Data Input Output 1)*1
I/O
Write Protect Input ( Data Input Output 2)*2
Ground
I/O
Data Input (Data Input Output 0)*1
I
Serial Clock Input
I/O
Hold Input (Data Input Output 3)*2
Power Supply
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI/QPI instructions
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