XC6223 查看數據表（PDF） - TOREX SEMICONDUCTOR
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XC6223 Datasheet PDF : 36 Pages
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XC6223 Series
■PIN CONFIGURATION
*The dissipation pad for the USPQ-4B03,USP-4 packages should be solder-plated in reference mount pattern and metal masking so as to
enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the VSS (No. 2) pin.
■PIN ASSIGNMENT
PIN NUMBER
USPQ-4B03 USP-4
SSOT-24
4
4
4
1
1
3
2
2
2
3
3
1
-
-
-
SOT-25
1
5
2
3
4
SOT-89-5
4
5
2
3
1
PIN NAME
VIN
VOUT
VSS
CE
NC
FUNCTIONS
Power Input
Output
Ground
ON/OFF Control
No Connection
■PIN FUNCTION ASSIGNMENT
CE Ethics Condition
H
L
OPEN
IC Operation State
ON/OFF
Operation ON
Operation OFF(Stand-by)
*
* Undefined state in XC6223 A/B/E/F. On the other hand, Operation OFF states in XC6223C/D/G/H because that an internal
pull-down resister maintains the CE pin voltage to be low.
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