XC6224 查看數據表（PDF） - TOREX SEMICONDUCTOR
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XC6224 Datasheet PDF : 26 Pages
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XC6224
Series
■PACKAGING INFORMATION (Continued)
● SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as one of reference data taken in the described
condition.
1. Measurement Condition (Reference data)
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used.)
Material: Glass Epoxy (FR-4)
Thickness: 1.6 mm
Through-hole: 4 x 0.8 Diameter
2. Power Dissipation vs. Ambient temperature
Board Mount (Tj max = 125℃)
Ambient Temperature（℃）
25
85
Power Dissipation Pd（mW）
600
240
評Eva価lua基tio板n Bレoaイrdア(Uウnit:トm（m単) 位：mm）
Thermal Resistance (℃/W)
166.67
700
600
500
400
300
200
100
0
25
Pd-TPad特vs性. Taグラフ
45
65
85
105
125
Ambie周nt T辺em温pe度ratTurae（T℃a (）℃)
21/26
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