B57861S 查看數據表（PDF） - Unspecified

零件编号

产品描述 (功能)

比赛名单

B57861S

NTC thermistors for temperature measurement

Unspecified 

Temperature measurement

Miniature sensors with bendable wires

B57861S

S861

Reflow soldering

Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D

Profile feature

Preheat and soak

- Temperature min

Tsmin

- Temperature max

Tsmax

- Time

tsmin to tsmax

Average ramp-up rate

Tsmax to Tp

Liquidous temperature

TL

Time at liquidous

tL

Peak package body temperature Tp1)

Time (tP)3) within 5 °C of specified

classification temperature (Tc)

Average ramp-down rate

Tp to Tsmax

Time 25 °C to peak temperature

Sn-Pb eutectic assembly

100 °C

150 °C

60 ... 120 s

3 °C/ s max.

183 °C

60 ... 150 s

220 °C ... 235 °C2)

20 s3)

6 °C/ s max.

maximum 6 min

Pb-free assembly

150 °C

200 °C

60 ... 180 s

3 °C/ s max.

217 °C

60 ... 150 s

245 °C ... 260 °C2)

30 s3)

6 °C/ s max.

maximum 8 min

1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.

2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.

3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.

Note: All temperatures refer to topside of the package, measured on the package body surface.

Number of reflow cycles: 3

Please read Cautions and warnings and

Important notes at the end of this document.

Page 11 of 20

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