NXP Semiconductors
Low-leakage double diode
Product data sheet
BAV170
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-tp
Rth j-a
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
Note
1. Device mounted on a FR4 printed-circuit board.
CONDITIONS
note 1
GRAPHICAL DATA
300
handbook, halfpage
IF
(mA)
200
(1)
MBG521
300
handbook, halfpage
IF
(mA)
200
VALUE
360
500
UNIT
K/W
K/W
MLB752 - 1
(1)
(2)
(3)
100
100
(2)
0
0
100
Tamb (oC)
200
Device mounted on a FR4 printed-circuit board.
(1) Single diode loaded.
(2) Double diode loaded.
Fig.2 Maximum permissible continuous forward
current as a function of ambient
temperature.
0
0
0.4
0.8
1.2
1.6
VF (V)
(1) Tj = 150 °C; typical values.
(2) Tj = 25 °C; typical values.
(3) Tj = 25 °C; maximum values.
Fig.3 Forward current as a function of forward
voltage; per diode.
2003 Mar 25
4