DG509A 查看數據表（PDF） - Intersil

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DG509A

CMOS Analog Multiplexers

Intersil 

Die Characteristics

DIE DIMENSIONS:

3810µm x 2770µm

METALLIZATION:

Type: Al

Thickness: 10kÅ ±1kÅ

Metallization Mask Layout

NC

DG506A

PASSIVATION:

Type: PSG/Nitride

Thickness: PSG: 7kÅ ±1.4kÅ

Nitride: 8kÅ ±1.2kÅ

WORST CASE CURRENT DENSITY:

9.1 x 104 A/cm2

DG506A

NC

V+

D

V-

S16

S8

S15

S7

S14

S6

S13

S5

S12

S4

S11

S3

S10

S2

S9

S1

GND NC

A3

A2

A1

A0

EN

10

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