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MAS1178ATC1 查看數據表(PDF) - Micro Analog systems

零件编号
产品描述 (功能)
比赛名单
MAS1178ATC1
MAS
Micro Analog systems MAS
MAS1178ATC1 Datasheet PDF : 5 Pages
1 2 3 4 5
PIN DESCRIPTION
DA1178.006
13 July, 2006
Pin Description
Symbol
x-coordinate
y-coordinate
Power Supply Voltage
Serial Bus Clock Input
VDD
182
CLK
645
1317
1329
Serial Bus Data Input
DA
418
1329
Programming Input
PV
876
1311
Voltage Control Input
VC
215
213
Crystal Oscillator Output
X2
1053
209
Crystal/Varactor Oscillator Input
X1
434
209
Power Supply Ground
VSS
617
2267
Buffer Output
OUT
1218
1329
Note: Because the substrate of the die is internally connected to GND, the die has to be connected to GND or
left floating. Please make sure that GND is the first pad to be bonded. Pick-and-place and all component
assembly are recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Input Voltage
Power Dissipation
Operating Temperature
Storage Temperature
Note 1: Not valid for programming pin PV
Symbol
VDD - VSS
VIN
PMAX
TOP
TST
Min
-0.3
VSS -0.3
-35
-55
Max
6.0
VDD + 0.3
100
85
150
Unit
V
V
mW
oC
oC
Note
1)
RECOMMENDED OPERATION CONDITIONS
Parameter
Supply Voltage
Supply Current
Operable Temperature
Storage Temperature
Symbol
VDD
Idd
TC
TS
Conditions
Vdd = 2.8 Volt
Relative humidity =
15%…70%
Min Typ Max Unit
2.7 2.8 5.5
V
2.3
mA
-30
+85
oC
-5
+40
oC
2 (5)

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