MAX756 查看數據表（PDF） - Maxim Integrated

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产品描述 (功能)

比赛名单

MAX756

3.3V/5V/Adjustable-Output, Step-Up DC-DC Converters

Maxim Integrated 

MAX756/MAX757

3.3V/5V/Adjustable-Output,

Step-Up DC-DC Converters

PC Layout and Grounding

The MAX756/MAX757 high peak currents and high-fre-

quency operation make PC layout important for mini-

mizing ground bounce and noise. The distance

between the MAX756/MAX757’s GND pin and the

ground leads of C1 and C2 in Figure 1 must be kept to

less than 0.2" (5mm). All connections to the FB and LX

pins should also be kept as short as possible. To

obtain maximum output power and efficiency and mini-

mum output ripple voltage, use a ground plane and

solder the MAX756/MAX757 GND (pin 7) directly to the

ground plane.

___________________Chip Topography

SHDN

LX

3/5 (MAX756)

FB (MAX757)

REF

GND

0.122"

(3.10mm)

GND

OUT

LBI

LBO

0.080"

(2.03mm)

TRANSISTOR COUNT: 758

SUBSTRATE CONNECTED TO OUT

________________________________________________________Package Information

EH

INCHES

DIM

MIN MAX

A 0.053 0.069

A1 0.004 0.010

B 0.014 0.019

C 0.007 0.010

D 0.189 0.197

E 0.150 0.157

e

0.050 BSC

H 0.228 0.244

h 0.010 0.020

L 0.016 0.050

α

0°

8°

MILLIMETERS

MIN MAX

1.35 1.75

0.10 0.25

0.35 0.49

0.19 0.25

4.80 5.00

3.80 4.00

1.27 BSC

5.80 6.20

0.25 0.50

0.40 1.27

0°

8°

21-325A

D

A

h x 45˚

α

0.127mm

0.004in.

e

A1

C

L

B

8-PIN PLASTIC

SMALL-OUTLINE

PACKAGE

8

Maxim Integrated

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