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MC33164

5V UNDERVOLTAGE SENSING CIRCUIT

Microsemi Corporation 

PRODUCT DATABOOK 1996/1997

MC33164/MC34164

5V UNDERVOLTAGE SENSING CIRCUIT

PRODUCTION DATA SHEET

A B S O L U T E M A X I M U M R AT I N G S (Note 1)

Input Supply Voltage (V )............................................................................... -1V to 12V

IN

RESET Output Voltage (VOUT) .......................................................................... -1V to 12V

Clamp Diode Forward Current .............................................................................. 100mA

Operating Junction Temperature

Plastic (DM - Package) ......................................................................................... 150°C

Storage Temperature Range ...................................................................... -65°C to 150°C

Lead Temperature (Soldering, 10 seconds) ............................................................ 300°C

Note 1. Values beyond which damage may occur. All voltages are specified with respect to

ground, and all currents are positive into the specified terminal.

T H E R M A L D ATA

DM PACKAGE:

THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA

LP PACKAGE:

165°C/W

THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA

156°C/W

Junction Temperature Calculation: T = T + (P x θ ).

J

A

D

JA

The θJA numbers are guidelines for the thermal performance of the device/pc-board system.

All of the above assume no ambient airflow.

PACKAGE PIN OUTS

RESET

INPUT

N.C.

GROUND

18

27

36

45

N.C.

N.C.

N.C.

N.C.

DM PACKAGE

(Top View)

3. GROUND

2. INPUT

1. RESET

LP PACKAGE

(Top View)

BLOCK DIAGRAM

INPUT

2(2)

RESET

1(1)

1.2 VREF

4(3)

GROUND

2

Copyright © 1997

Rev. 1.5 11/97

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