RMDA29000 查看數據表（PDF） - Fairchild Semiconductor
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RMDA29000 Datasheet PDF : 8 Pages
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DRAIN SUPPLY
Vd = +5V
10000pF
BOND WIRE Ls
MMIC CHIP
RF IN
L 100pF
L
RF OUT
GROUND
(Back of Chip)
L
100pF
L
BOND WIRE Ls
10000pF
GATE SUPPLY
Vg
Figure 3. Recommended Application Schematic Circuit Diagram
Vdd (POSITIVE)
2 MIL GAP
DIE-ATTACH
80Au/20Sn
ALUMINA
50Ω
RF INPUT
10000pF
100pF
ALUMINA
50Ω
RF OUTPUT
100pF
10000pF
L < 0.015"
(4 Places)
Vg (NEGATIVE)
Note:
Use 0.003" by 0.0005" Gold Ribbon for bonding. RF input and output bonds should be less than 0.015" long with stress relief.
Vd should be biased from 1 supply as shown. Vg should be biased from 1 supply.
Figure 4. Recommended Assembly Diagram
©2004 Fairchild Semiconductor Corporation
RMDA29000 Rev. C
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