CXA2566M 查看數據表（PDF） - Sony Semiconductor

零件编号

产品描述 (功能)

比赛名单

CXA2566M

Headphone Stereos

Sony Semiconductor 

Package Outline

Unit: mm

16PIN SOP (PLASTIC)

+ 0.4

9.9 – 0.1

16

9

CXA2566M

+ 0.4

1.85 – 0.15

0.15

+ 0.2

0.1 – 0.05

1

0.45 ± 0.1

8

1.27

+ 0.1

0.2 – 0.05

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-16P-L01

SOP016-P-0300

0.24 M

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

COPPER ALLOY

0.2g

– 12 –

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