GS880Z18BGT-150V 查看數據表（PDF） - Giga Semiconductor

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GS880Z18BGT-150V

9Mb Pipelined and Flow Through Synchronous NBT SRAM

Giga Semiconductor 

TQFP Package Drawing (Package T)

Symbol Description Min. Nom. Max

θ

L

L1

c

A1

Standoff

0.05 0.10 0.15

A2

Body Thickness 1.35 1.40 1.45

b

Lead Width

0.20 0.30 0.40

c

Lead Thickness 0.09 — 0.20

D Terminal Dimension 21.9 22.0 22.1

D1

Package Body 19.9 20.0 20.1

E

Terminal Dimension 15.9 16.0 16.1

E1

Package Body 13.9 14.0 14.1

e

Lead Pitch

— 0.65 —

L

Foot Length

0.45 0.60 0.75

L1

Lead Length

— 1.00 —

Y

Coplanarity

0.10

θ

Lead Angle

0° — 7°

e

b

A1

A2

Notes:

1. All dimensions are in millimeters (mm).

2. Package width and length do not include mold protrusion.

GS880Z18/32/36BT-xxxV

E1

E

Rev: 1.03 6/2006

21/24

Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.

© 2001, GSI Technology

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