80C883 查看數據表（PDF） - Intersil

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80C883

High Performance Microprocessor with Memory Management and Protection

Intersil 

Die Characteristics

DIE DIMENSIONS:

286 x 283 x 19 ±1mils

METALLIZATION:

Type: Si-Al

Thickness: 8kÅ

Metallization Mask Layout

80C286/883

GLASSIVATION:

Type: Nitrox

Thickness: 10kÅ

WORST CASE CURRENT DENSITY: 2 X 105A/cm2

LEAD TEMPERATURE: (10s Soldering): ≤ 300oC

80C286/883

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3-140

Spec Number

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