HMC132C8(2001) 查看數據表（PDF） - Hittite Microwave
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HMC132C8 Datasheet PDF : 6 Pages
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MICROWAVE CORPORATION
HMC132C8
HMC132C8 SMT HIGH-ISOLATION SPDT SWITCH DC - 8 GHZ
FEBRUARY 2001
Evaluation Circuit Board
7
The circuit board used in the final application should use RF circuit design techniques. Signal lines should have
50 ohm impedance while the package ground leads should be connected directly to the ground plane similar to
that shown above. A sufficient number of VIA holes should be used to connect the top and bottom ground planes.
The evaluation circuit board as shown is available from Hittite upon request.
Evaluation Circuit Board Layout Design Details
Layout Technique
Material
Dielectric Thickness
50 Ohm Line Width
Gap to Ground Edge
Ground VIA Hole Diameter
Connectors
Grounded Co-Planar Waveguide (GCPW)
Rogers 4350
0.020" (0.51 mm)
0.034" (0.86 mm)
0.010" (0.25 mm)
0.014" (0.36 mm)
SMA-F ( EF - Johnson P/N 142-0701-806)
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
7 - 10
Web Site: www.hittite.com
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