ORDERING INFORMATION
DA1174.001
6 February, 2001
Product Code
MAS1174ATC1
Product
IC FOR VCXO
Package
Wafer, EWS tested
MAS1174
IC FOR VCXO
SMD Package T.B.D.
Please contact Micro Analog Systems Oy for other wafer thickness options.
Comments
Die size 1200 x 1278 µm,
wafer thickness 400 µm
LOCAL DISTRIBUTOR
MICRO ANALOG SYSTEMS OY CONTACTS
Micro Analog Systems Oy
Kamreerintie 2, P.O. Box 51
FIN-02771 Espoo, FINLAND
http://www.mas-oy.com
Tel. (09) 80 521
Tel. Int. +358 9 80 521
Telefax +358 9 805 3213
Email: info@mas-oy.com
NOTICE
Micro Analog Systems Oy reserves the right to make changes to the products contained in this data sheet in order to improve the design
or performance and to supply the best possible products. Micro Analog Systems Oy assumes no responsibility for the use of any circuits
shown in this data sheet, conveys no license under any patent or other rights unless otherwise specified in this data sheet, and makes
no claim that the circuits are free from patent infringement. Applications for any devices shown in this data sheet are for illustration only
and Micro Analog Systems Oy makes no claim or warranty that such applications will be suitable for the use specified without further
testing or modification.
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