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MC74VHC240DWR2G

Octal Bus Buffer/Line Driver Inverting with 3-State Outputs

ON Semiconductor 

MC74VHC240

Octal Bus Buffer/Line Driver

Inverting with 3-State Outputs

The MC74VHC240 is an advanced high speed CMOS octal bus

buffer fabricated with silicon gate CMOS technology. It achieves high

speed operation similar to equivalent Bipolar Schottky TTL while

maintaining CMOS low power dissipation.

The MC74VHC240 is an inverting 3−state buffer, and has two

active−low output enables. This device is designed to drive bus lines

or buffer memory address registers.

The internal circuit is composed of three stages, including a buffer

output which provides high noise immunity and stable output. The

inputs tolerate voltages up to 7V, allowing the interface of 5V systems

to 3V systems.

• High Speed: tPD = 3.6 ns (Typ) at VCC = 5 V

• Low Power Dissipation: ICC = 4 μA (Max) at TA = 25°C

• High Noise Immunity: VNIH = VNIL = 28% VCC

• Power Down Protection Provided on Inputs

• Balanced Propagation Delays

• Designed for 2 V to 5.5 V Operating Range

• Low Noise: VOLP = 0.9 V (Max)

• Pin and Function Compatible with Other Standard Logic Families

• Latchup Performance Exceeds 300 mA

• ESD Performance: HBM > 2000 V; Machine Model > 200 V

• Chip Complexity: 120 FETs or 30 Equivalent Gates

• These Devices are Pb−Free and are RoHS Compliant

OEA 1

A1 2

YB4 3

A2 4

YB3 5

A3 6

YB2 7

A4 8

YB1 9

GND 10

20 VCC

19 OEB

18 YA1

17 B4

16 YA2

15 B3

14 YA3

13 B2

12 YA4

11 B1

Figure 1. Pin Assignment

http://onsemi.com

20

1

SOIC−20

DW SUFFIX

CASE 751D

MARKING

DIAGRAMS

20

VHC240

AWLYYWWG

1

20

1

TSSOP−20

DT SUFFIX

CASE 948E

20

VHC

240

ALYWG

G

1

VHC240

A

WL, L

Y

WW, W

G or G

= Specific Device Code

= Assembly Location

= Wafer Lot

= Year

= Work Week

= Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

Device

Package Shipping†

MC74VHC240DWR2G SOIC−20 1000 Units/Reel

MC74VHC240DTR2G TSSOP−20 2500 Units/Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

FUNCTION TABLE

INPUTS

OEA, OEB

A, B

L

L

L

H

H

X

OUTPUTS

YA, YB

H

L

Z

© Semiconductor Components Industries, LLC, 2011

1

May, 2011 − Rev. 5

Publication Order Number:

MC74VHC240/D

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