APL8208A 查看數據表（PDF） - APLUS INTEGRATED CIRCUITS
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APL8208A Datasheet PDF : 10 Pages
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APLUS
BONDING DIAGRAM
12 11 10 9 8 7
Y
X
(0,0)
65
NC
13 14 15 16 NC 1 2
34
Note: Substrate must be connected to GND
Pad size = 80 µm x 80 µm
Die size = 2350 x 2260 µm
92.5 x 88.97 mil
Note:
Programming requires connection to
pins 4, 5, 6, 8, 9, 12, 15, and 16.
API8208A
BONDING PARAMETERS
Pin
Name
X
1
OUT1
-6
2
VOUT1
297
3
VOUT2
803
4
GND
1058
5
OUT2
927
6
OUT3
697
7
COUT
199
8
OSC
–103
9
VPP
–358
10
TG1
–566
11
TG2
–810
12
VCC
–1059
13
TG3
–934
14
TG4
–689
15
SBT
–444
16
IRP
–200
Y
–1017
–1017
–1017
–1017
1017
1017
1017
1017
1017
1017
1017
1017
–1017
–1017
–1017
–1017
ABSOLUTE MAXIMUM RATINGS
Symbol
VCC - GND
VIN
VOUT
TA
TSTG
Parameter
Terminal Voltage with Respect to GND
Operating Temperature
Storage Temperature
Value
–0.5 to +7.0
GND – 0.3 < VIN < VCC + 0.3
GND < VOUT < VCC
–10 to +85
–55 to +125
Unit
V
V
V
°C
°C
4
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