MAX2022EVKIT 查看數據表（PDF） - Maxim Integrated

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比赛名单

MAX2022EVKIT

MAX2022 Evaluation Kit

Maxim Integrated 

MAX2022 Evaluation Kit

C = 10pF

I

C = 10pF

L = 15nH

C = 10pF

Q

C = 10pF

L = 15nH

Figure 1. Diplexer Network

C = 15pF

100Ω

C = 15pF

100Ω

C = 15pF

100Ω

C = 15pF

100Ω

MAX2022

RF MODULATOR

LO

0°

90°

∑

Layout Considerations

The MAX2022 evaluation board can be a guide for your

board layout. Pay close attention to thermal design and

close placement of components to the IC. The

MAX2022’s package exposed paddle (EP) conducts

heat from the device and provides a low-impedance

electrical connection to the ground plane. The EP must

be attached to the PCB ground plane with a low ther-

mal and electrical impedance contact. Ideally, this is

achieved by soldering the backside of the package

directly to a top metal ground plane on the PCB.

Alternatively, the EP can be connected to an internal or

bottom-side ground plane using an array of plated vias

directly below the EP. The MAX2022 EV kit uses nine

evenly spaced 0.016in-diameter, plated through holes

to connect the EP to the lower ground planes.

Depending on the ground plane spacing, large sur-

face-mount pads in the IF path may need to have the

ground plane relieved under them to reduce parasitic

shunt capacitance.

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