MAX2029ETP/T 查看數據表（PDF） - Maxim Integrated

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MAX2029ETP/T

High-Linearity, 815MHz to 1000MHz Upconversion/Downconversion Mixer with LO Buffer/Switch

Maxim Integrated 

High-Linearity, 815MHz to 1000MHz Upconversion/

Downconversion Mixer with LO Buffer/Switch

ABSOLUTE MAXIMUM RATINGS

VCC to GND ...........................................................-0.3V to +5.5V

RF (RF is DC shorted to GND through a balun)..................50mA

LO1, LO2 to GND ..................................................-0.3V to +0.3V

IF+, IF- to GND ...........................................-0.3V to (VCC + 0.3V)

TAP to GND ...........................................................-0.3V to +1.4V

LOSEL to GND ...........................................-0.3V to (VCC + 0.3V)

LOBIAS to GND..........................................-0.3V to (VCC + 0.3V)

RF, LO1, LO2 Input Power* ............................................+20dBm

Continuous Power Dissipation (TC = +85°C) (Note A)

20-Pin Thin QFN-EP................................................................5W

θJA (Note B)....................................................................+38°C/W

θJC .................................................................................+13°C/W

Operating Temperature Range (Note C) ....TC = -40°C to +85°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Note A: Based on junction temperature TJ = TC + (θJC x VCC x ICC). This formula can be used when the temperature of the

exposed paddle is known while the device is soldered down to a PCB. See the Applications Information section for details.

The junction temperature must not exceed +150°C.

Note B: Junction temperature TJ = TA + (θJA x VCC x ICC). This formula can be used when the ambient temperature of the EV kit

PCB is known. The junction temperature must not exceed +150°C. See the Applications Information section for details.

Note C: TC is the temperature on the exposed paddle of the package. TA is the ambient temperature of the device and PCB.

*Maximum reliable continuous input power applied to the RF, LO, and IF ports of this device is +15dBm from a 50Ω source.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

DC ELECTRICAL CHARACTERISTICS

(Typical Application Circuit, VCC = +4.75V to +5.25V, no RF signals applied, TC = -40°C to +85°C. IF+ and IF- are DC grounded through

an IF balun. Typical values are at VCC = +5V, TC = +25°C, unless otherwise noted.)

PARAMETER

Supply Voltage

Supply Current

LOSEL Input Logic-Low

LOSEL Input Logic-High

Input Current

SYMBOL

VCC

ICC

VIL

VIH

IIH, IIL

CONDITIONS

MIN TYP MAX UNITS

4.75 5.00 5.25

V

85 100

mA

0.8

V

2

V

±0.01

µA

AC ELECTRICAL CHARACTERISTICS

(Typical Application Circuit, C5 = 3.3pF, L1 and C4 not used, VCC = +4.75V to +5.25V, RF and LO ports are driven from 50Ω sources,

PLO = -3dBm to +3dBm, PRF = 0dBm, fRF = 815MHz to 1000MHz, fLO = 570MHz to 900MHz, fIF = 90MHz, fLO < fRF, TC = -40°C to

+85°C, unless otherwise noted. Typical values are at VCC = +5V, PLO = 0dBm, fRF = 920MHz, fLO = 830MHz, fIF = 90MHz,

TC = +25°C, unless otherwise noted.) (Note 1)

PARAMETER

RF Frequency Range

LO Frequency Range

IF Frequency Range

LO Drive

LO1-to-LO2 Isolation (Note 3)

SYMBOL

CONDITIONS

MIN

fRF (Note 2)

815

fLO (Note 2)

570

fIF

External IF transformer dependence (Note 2) DC

PLO (Note 2)

-3

LO2 selected, PLO = +3dBm, TC = +25°C,

fRF = 920MHz to 960MHz, fLO = 830MHz to

48

870MHz

LO1 selected, PLO = +3dBm, TC = +25°C,

fRF = 920MHz to 960MHz, fLO = 830MHz to

50

870MHz

TYP

53

56

MAX

1000

900

250

+3

UNITS

MHz

MHz

MHz

dBm

dB

Maximum LO Leakage at RF Port

Maximum LO Leakage at IF Port

PLO = +3dBm

PLO = +3dBm, fRF = 920MHz to 960MHz,

fLO = 830MHz to 870MHz (Note 3)

-17

-29.5 -23

dBm

dBm

2 _______________________________________________________________________________________

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