4. Outline Drawing & Dimension
1. Tolerance is ±0.10 mm
2. The maximum compressing force is 15N on the body ⓐ
3. Do not place pressure on the encapsulation resin ⓑ
Left Side View
Top View
Bottom View
Anode Mark ⓐ ⓑ
Cathode
Anode
Front View
Recommended Land Pattern
Notes:
1) This LED has built-in ESD protection device(s) connected in parallel to LED Chip(s).
2) Ts point & measurement method
① Measure the nearest point to the thermal pad. If necessary, remove PSR of PCB to reach Ts
point.
② Thermal pad must be soldered to the PCB to dissipate heat properly. Otherwise, LED can be
damaged.
3) Precautions
① The pressure on the LEDs will influence to the reliability of the LEDs. Precautions should be
taken to avoid the strong pressure on the LEDs. Do not put stress on the LEDs during heating.
② Re-soldering should not be done after the LEDs have been soldered. If re-soldering is
unavoidable, LED`s characteristics should be carefully checked before and after such repair.
③ Do not stack assembled PCBs together. Since materials of LEDs is soft, abrasion between two
PCB assembled with LED might cause catastrophic failure of the LEDs.
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