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STF7N52K3 查看數據表(PDF) - STMicroelectronics

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STF7N52K3 Datasheet PDF : 18 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
STB7N52K3, STD7N52K3, STF7N52K3, STP7N52K3
1
Electrical ratings
Electrical ratings
Table 2. Absolute maximum ratings
Symbol
Parameter
Value
Unit
TO-220 DPAK D²PAK TO-220FP
VDS Drain-source voltage (VGS = 0)
VGS Gate- source voltage
ID Drain current (continuous) at TC = 25 °C
ID
IDM (2)
Drain current (continuous) at TC = 100 °C
Drain current (pulsed)
PTOT Total dissipation at TC = 25 °C
IAR
Avalanche current, repetitive or not-
repetitive (pulse width limited by Tj max)
Single pulse avalanche energy
EAS (starting Tj = 25°C, ID = IAR, VDD = 50V)
Gate source ESD(HBM-C = 100 pF,
VESD(G-S) R = 1.5 kΩ)
dv/dt (3) Peak diode recovery voltage slope
VISO
Insulation withstand voltage (RMS) from
all three leads to external heat sink
(t = 1 s; TC = 25 °C)
Tstg Storage temperature
Tj Max. operating junction temperature
1. Limited by package
2. Pulse width limited by safe operating area
3. ISD 6.3 A, di/dt = TBD, VDD = 80% V(BR)DSS.
525
± 30
6.2
4.5
24.8
90
6.2
V
V
6.2 (1)
A
4.5 (1)
A
24.8 (1)
A
25
W
A
100
mJ
2500
12
V
V/ns
2500
V
-55 to 150
°C
150
°C
Table 3. Thermal data
Symbol
Parameter
Value
Unit
TO-220 DPAK D²PAK TO-220FP
Rthj-case Thermal resistance junction-case max
Rthj-pcb Thermal resistance junction-pcb max
Rthj-amb Thermal resistance junction-ambient max
Tl
Maximum lead temperature for soldering
purpose
62.5
1.39
50
30
300
5
°C/W
°C/W
62.5 °C/W
°C
Doc ID 14896 Rev 2
3/18

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