![](/html/Sony/85136/page22.png)
Package Outline
Unit: mm
128PIN TFBGA (PLASTIC)
11.0
0.3 S A
CXD3521GG
x4
0.20
0.2 S
10.6 ± 0.1
S
SONY CODE
EIAJ CODE
JEDEC CODE
0.1 S
0.8
1.1
A
M
L
K
J
H
B
G
F
E
D
C
B
A
1 2 3 4 5 6 7 8 9 10 11 12
128 - φ 0.5 ± 0.05 φ 0.08 M S A B
PACKAGE STRUCTURE
PACKAGE MATERIAL
ORGANIC SUBSTRATE
TFBGA-128P-061
TERMINAL TREATMENT
P-TFBGA128-11x11-0.8
TERMINAL MATERIAL SOLDER
PACKAGE MASS
0.22g
– 22 –
Sony Corporation