NCV51411(2019) 查看數據表（PDF） - ON Semiconductor
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NCV51411
(Rev.:2019)
(Rev.:2019)
ON Semiconductor
NCV51411 Datasheet PDF : 18 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
18
1
SCALE 2:1
DFN18 6x5, 0.5P
CASE 505−01
ISSUE D
A
D
B
PIN 1 LOCATION
E
2X
0.15 C
2X
0.15 C
TOP VIEW
0.10 C
18X
0.08 C
18X L
(A3)
A1
SIDE VIEW
D2
e
1
9
A
C
SEATING
PLANE
E2
18X K
18
10
18X b
BOTTOM VIEW
0.10
0.05
CA B
C NOTE 3
SOLDERING FOOTPRINT
5.30
1
18X
0.75
0.50
PITCH
4.19
18X
0.30
DATE 17 NOV 2006
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D
6.00 BSC
D2 3.98 4.28
E
5.00 BSC
E2 2.98 3.28
e
0.50 BSC
K 0.20 −−−
L 0.45 0.65
GENERIC
MARKING DIAGRAM*
1
XXXXXXXX
XXXXXXXX
AWLYYWW
XXXXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
YY
= Year
WW = Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
3.24
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
DESCRIPTION:
98AON11920D
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
18 PIN DFN, 6X5 MM. 0.5 MM PITCH
PAGE 1 OF 1
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