ACS722 查看數據表（PDF） - Allegro MicroSystems

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ACS722

High Accuracy, Galvanically Isolated Current Sensor IC With Small Footprint SOIC8 Package

Allegro MicroSystems 

ACS722

High Accuracy, Galvanically Isolated Current Sensor IC

With Small Footprint SOIC8 Package

Package Outline Drawing

For Reference Only – Not for Tooling Use

(Reference MS-012AA)

Dimensions in millimeters – NOT TO SCALE

Dimensions exclusive of mold flash, gate burrs, and dambar protrusions

Exact case and lead configuration at supplier discretion within limits shown

4.90 ±0.10

8

8°

0°

0.25

0.17

0.65

1.27

8

1.75

A

12

8X

0.10 C

0.51

0.31

1.27 BSC

3.90 ±0.10 6.00 ±0.20

Branded Face

1.75 MAX

C

SEATING

PLANE

1.04 REF

1.27

0.40

0.25 BSC

SEATING PLANE

GAUGE PLANE

0.25

0.10

A Terminal #1 mark area

B Branding scale and appearance at supplier discretion

C Reference land pattern layout (reference IPC7351 SOIC127P600X175-8M);

all pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary

to meet application process requirements and PCB layout tolerances

Figure 6: Package LC, 8-pin SOICN

5.60

12

C PCB Layout Reference View

NNNNNNN

TPP-AAA

LLLLL

1

B Standard Branding Reference View

N = Device part number

T = Device temperature range

P = Package Designator

A = Amperage

L = Lot number

Belly Brand = Country of Origin

Allegro MicroSystems, LLC

21

115 Northeast Cutoff

Worcester, Massachusetts 01615-0036 U.S.A.

1.508.853.5000; www.allegromicro.com

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