LLL317R71H103MD01K 查看數據表（PDF） - Unspecified

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LLL317R71H103MD01K

Chip Multilayer Ceramic Capacitors for General

Unspecified 

!Note • Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.

• This catalog has only typical specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.

Notice

Continued from the preceding page.

Pattern Forms

Placing Close to Chassis

Prohibited

Chassis

Solder (ground)

Correct

Solder Resist

Placing

of Chip Components

and Leaded Components

Placing

of Leaded Components

a er Chip Component

Lateral Mounting

Electrode Pattern

Lead Wire

in section

in section

Soldering Iron

Lead Wire

in section

Solder Resist

Solder Resist

Solder Resist

C02E.pdf

Nov.27,2017

in section

in section

in section

2. Land Dimensions

2-1. Please refer to the land dimensions in table 1 for flow

soldering, table 2 for reflow soldering, table 3 for

reflow soldering for ZRB Series, table 4 for reflow

soldering for LLA Series, table 5 for reflow soldering

for LLM Series.

Please confirm the suitable land dimension by

evaluating of the actual SET / PCB.

Table 1 Flow Soldering Method

Series

Chip Dimension Code

(L/W)

Chip (LgW)

GQM/GR3/GRJ/GRM 18

GQM/GR3/GRJ/GRM 21

GR3/GRJ/GRM

31

LLL

21

LLL

31

1.6g0.8

2.0g1.25

3.2g1.6

1.25g2.0

1.6g3.2

Flow soldering can only be used for products with a chip size from 1.6x0.8mm to 3.2x1.6mm.

Chip Capacitor

Land

b

a

Solder Resist

a

0.6 to 1.0

1.0 to 1.2

2.2 to 2.6

0.4 to 0.7

0.6 to 1.0

b

c

0.8 to 0.9

0.6 to 0.8

0.9 to 1.0

0.8 to 1.1

1.0 to 1.1

1.0 to 1.4

0.5 to 0.7

1.4 to 1.8

0.8 to 0.9

2.6 to 2.8

(in mm)

Continued on the following page.

284

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