QN8075 查看數據表（PDF） - Unspecified

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QN8075

Single Chip Low Power FM Receiver for Portable Devices

Unspecified 

8 Solder Reflow Profile

8.1 Package Peak Reflow Temperature

QN8075 is assembled in a lead-free SOP16 and SSOP16 packages. Since the geometrical size of QN8075 is 9.9× 6 × 1.75

mm and 4.9 × 6 × 1.75 mm, the volume and thickness is in the category of volume<350 mm3 and thickness<1.6 mm in

Table 4-2 of IPC/JEDEC J-STD-020C. The peak reflow temperature is:

Tp = 260o C

The temperature tolerance is +0oC and -5oC. Temperature is measured at the top of the package.

8.2 Classification Reflow Profiles

Profile Feature

Average Ramp-Up Rate (tsmax to tP)

Temperature Min (Tsmin)

Pre-heat: Temperature Max (Tsmax)

Time (ts)

Time

Temperature (TL)

maintained

above:

Time (tL)

Peak/Classification Temperature (Tp)

Time within 5°C of Actual Peak

Temperature (tp)

Ramp-Down Rate

Time 25°C to Peak Temperature

Specification*

3°C/second max.

150°C

200°C

60-180 seconds

217°C

60-150 seconds

260°C

20-40 seconds

6°C/second max.

8 minutes max.

*Note: All temperatures are measured at the top of the package.

Rev 0.2c (09/02)

Copyright ©2011 by Quintic Corporation

Page 18

Confidential A

Confidential Information contained herein is covered under Non-Disclosure Agreement (NDA).

Advance Technical Information. This is a product under development. Characteristics and specifications are subject to change without notice.

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