APR3011 查看數據表（PDF） - Anpec Electronics

零件编号

产品描述 (功能)

比赛名单

APR3011

MicroPower Microprocessor Reset Circuit

Anpec Electronics 

APR3011/2/3

Classification Reflow Profiles (Cont.)

Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures

Package Thickness

<2.5 mm

≥2.5 mm

Volume mm3

<350

240 +0/-5°C

225 +0/-5°C

Volume mm3

≥350

225 +0/-5°C

225 +0/-5°C

Table 2. Pb-free Process – Package Classification Reflow Temperatures

Package Thickness

Volume mm3

<350

Volume mm3

350-2000

Volume mm3

>2000

<1.6 mm

260 +0°C*

260 +0°C*

260 +0°C*

1.6 mm – 2.5 mm

260 +0°C*

250 +0°C*

245 +0°C*

≥2.5 mm

250 +0°C*

245 +0°C*

245 +0°C*

* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated

classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL

level.

Customer Service

Anpec Electronics Corp.

Head Office :

No.6, Dusing 1st Road, SBIP,

Hsin-Chu, Taiwan, R.O.C.

Tel : 886-3-5642000

Fax : 886-3-5642050

Taipei Branch :

2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,

Sindian City, Taipei County 23146, Taiwan

Tel : 886-2-2910-3838

Fax : 886-2-2917-3838

Copyright © ANPEC Electronics Corp.

16

Rev. A.4 - Jan., 2009

www.anpec.com.tw

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