78L09AC 查看數據表（PDF） - Integral Corp.

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78L09AC

CHIP FOR THREE-TERMINAL POSITIVE VOLTAGE REGULATOR IC

Integral Corp. 

TRANSISTOR PLANT semiconductor technical data

Quality System for producing discrete semiconductor devices and integrated circuits conforms

to the requirements of STB ISO 9002-96

78L09AC

CHIP FOR THREE-TERMINAL

POSITIVE VOLTAGE REGULATOR IC

Features:

! Output current in excess of 100 mA

! No external components required

! Internal short circuit current limiting

! Internal thermal overload protection

! Available in either ± 5% selections

Physical Characteristics:

Wafer Diameter ……100 ± 0.5 mm

Wafer thickness ….. 420 ± 20 µm;

Die size …………….. 1.3 x 1.2 mm2 ;

Scribe width ………... 80 µm

Passivation …………. PSG

Pad #

1

2

3

Pad

name

OUT

IN

GND

Description

Output

Input

Ground

Bond Pad (µm)

101 x 101

101 x 101

101 x 101

♦Maximum Ratings (Ta = 25°C)

♦Input Voltage – 30V

♦Operating Junction

Temperature (Tj = 125°C)

Substrate is Common and should be connected to Pad 2

ELECTRICAL CHARACTERISTICS CHIPS ON WAFER (Ta=25°C)

(Vin=15V, Io=40mA, Ci=0.33µF, Co=0.1µF, Tj = + 25°C, unless otherwise noted.)

Characteristic Symbol

Test Condition

Min Max Unit

Output Voltage

Vo

11.5V ≤ Vin ≤ 24V,1mA ≤ Io ≤ 40mA 8.62 9.38

1mA ≤ Io ≤ 70mA

8.62 9.38

V

Line Regulation

ΔVv

11.5V ≤ Vin ≤ 24V

12V ≤ Vin ≤ 24V

158

113

mV

Load Regulation

ΔVi

1mA ≤ Io ≤ 100mA

1mA ≤ Io ≤ 40mA

81

36

mV

Quiescent

Current

Ib

5.8 mA

Quiescent

Current Change

ΔIb

11V ≤ Vin ≤ 23V

1mA ≤ Io ≤ 40mA

1.4

0.09

mA

* The parameters are guaranteed after scribing and chip encasement.

E-mail: TTalanova@transistor.com.by

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