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EGP30A 查看數據表(PDF) - New Jersey Semiconductor

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EGP30A Datasheet PDF : 2 Pages
1 2
^£.m,L-L.onauctoi Lpioaucti.,
20 STERN AVE.
SPRINGFIELD, NEW JERSEY 07081
U.S.A.
TELEPHONE: (973) 376-2922
(212) 227-6005
FAX: (973) 376-8960
3 Amp. Glass Passivated Avalanche Ultrafast Recovery Eectifiet
Dimensions in mm.
DO-201AD
(Plastic)
Voltage
50 to 600V
Current
3 A at 55 °C.
Mounting instructions
1. Min. distance from body to soldering point,
4 mm.
2. Max. solder temperature, 350 °C.
3. Max.soldering time, 3.5 sec.
4. Do not bend lead at a point closer than
3 mm. to the body
• Glass Passivated Junction
• High current capability
• The plastic material carries
U/L recognition 94 V-0
• Terminals: Axial Leads
• Polarity: Color band denotes cathode
Maximum Ratings, according to IECpublication No. 134
EGF30A EGP30B EGF30D EGP30F EGF30G EGP30J
VRRM Peak Recurrent reverse voltage (V)
VRMS Maximum RMSvoltage
VDC Maximum DC blocking voltage
^F(AV) Forward current at Tamb = 55 °C
IFRM Recurrent peak forward current
IFSM
8.3 ms. peak forward surge current
(Jedec Method)
Max. reverse recovery time from
trr
I F = 0 . 5 A ; I R = 1 A ; 1^ = 0.25 A
q
Typical Junction Capacitance at 1MHz
and reverse voltaje of 4VDC
T, Operating temperature range
T•'•stg Storage temperature range
Maximum non repetitive peak
-t-RSM reverse avalanche energy
IR = 1A ; Tj = 25 °C
50 100 200 300 4(30 600
35 70 140 210 2f30 420
50 100 200 300 4(30 600
3A
30 A
125A
50ns
90 pF
45 PF
- 6 5 t o + 150°C
- 6 5 t o + 150 °C
20 mj
Electrical Characteristics at Tamb = 25 °C
VF Max. forward voltage drop at IF - 3 A
Max. reverse current atV^ at ^5 °C
IR
Rthj-a Max. thermal resistance ( 1 = 1 0 mm.)
0.95V
5pA
50 p A
30°C/W
1,25V
Quality Semi-Conductors

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