TIPP115 查看數據表（PDF） - Power Innovations
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TIPP115 Datasheet PDF : 6 Pages
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TIPP115, TIPP116, TIPP117
PNP SILICON POWER DARLINGTONS
MAY 1989 - REVISED MARCH 1997
MECHANICAL DATA
LP003 (TO-92)
3-pin cylindical plastic package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
LP003 (TO-92)
5,21
4,44
3,43 MIN.
2,67
2,03
4,19
3,17
2,67
2,03
LP003 Falls Within JEDEC
TO-226AA Dimensions
5,34
Seating Plane
4,32
1,27
(see Note A)
0,56
0,40
1
12,7 MIN.
3
1,40
0,41
1,14
2
0,35
2,67
2,41
ALL LINEAR DIMENSIONS IN MILLIMETERS
NOTE A: Lead dimensions are not controlled in this area.
PRODUCT INFORMATION
MDXXAX
3
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