MAX2042AETPT 查看數據表（PDF） - Maxim Integrated

零件编号

产品描述 (功能)

比赛名单

MAX2042AETPT

SiGe High-Linearity, 1600MHz to 3900MHz Upconversion/Downconversion Mixer with LO Buffer

Maxim Integrated 

MAX2042A

SiGe High-Linearity, 1600MHz to 3900MHz

Upconversion/Downconversion Mixer with LO Buffer

ABSOLUTE MAXIMUM RATINGS

VCC to GND..........................................................-0.3V to +5.5V

IF+, IF-, LOBIAS to GND ......................... -0.3V to (VCC + 0.3V)

RF, LO Input Power....................................................... +20dBm

IF Input Power (50ω source)......................................... +18dBm

RF, LO Current (RF and LO are DC shorted to

GND through a balun)....................................................50mA

Operating Case Temperature Range (Note 1)....... -40NC to +85NC

Continuous Power Dissipation (Note 2) ..............................5.0W

Junction Temperature .....................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering 10s) .................................+300NC

Soldering Temperature (reflow) ......................................+260NC

Note 1: TC is the temperature on the exposed pad of the package. TA is the ambient temperature of the device and PCB.

Note 2: Based on junction temperature TJ = TC + (BJC x VCC x ICC). This formula can be used when the temperature of the

exposed pad is known while the device is soldered down to a PCB. See the Applications Information section for details.

The junction temperature must not exceed +150NC.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS

TQFN

Junction-to-Ambient

Thermal Resistance BJA (Notes 3, 4) ....................... +38°C/W

Junction-to-Case

Thermal Resistance BJC (Notes 2, 4)....................... +13°C/W

Note 3: Junction temperature TJ = TA + (BJA x VCC x ICC). This formula can be used when the ambient temperature of the PCB is

known. The junction temperature must not exceed +150NC.

Note 4: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

5.0V SUPPLY DC ELECTRICAL CHARACTERISTICS

(Typical Application Circuit, VCC = 4.75V to 5.25V, no input AC signals. TC = -40NC to +85NC, unless otherwise noted. Typical values

are at VCC = 5.0V, TC = +25NC.)

PARAMETER

Supply Voltage

Supply Current

SYMBOL

VCC

ICC

CONDITIONS

MIN TYP MAX UNITS

4.75

5

5.25

V

140 162

mA

3.3V SUPPLY DC ELECTRICAL CHARACTERISTICS

(Typical Application Circuit, VCC = 3.0V to 3.6V, no input AC applied. TC = -40NC to +85NC, unless otherwise noted. Typical values

are at VCC = 3.3V, TC = +25NC.)

PARAMETER

Supply Voltage

Supply Current

SYMBOL

VCC

ICC

CONDITIONS

MIN TYP MAX UNITS

3.0

3.3

3.6

V

122

mA

_________________________________________________________________ Maxim Integrated Products 4

Share Link: