FAN7601B(2011) 查看數據表（PDF） - Fairchild Semiconductor
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FAN7601B Datasheet PDF : 10 Pages
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Physical Dimensions
5.12
4.72
4.00
10
6
6.30
4.15
5.70
3.75
0.65
1.75
5.60
PIN ONE
INDICATOR
#1
5
(1.00)
TOP VIEW
#1
(1.00)
LAND PATTERN RECOMMENDATION
SEE DETAIL A
1.80 MAX
0.25
0.10
(0.26)
0.506
0.306
SIDE VIEW
R0.20
0.30
0.15
END VIEW
R0.15
NOTES:
R0.15
A) NO DRAWING STANDARD APPLIES TO THIS PACKAGE
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS.
D) LAND PATTERN RECOMMENDATION IS FSC SOURCED.
E) DRAWING FILE NAME AND REVISION : MKT-MSB10A,REV1
0.70
0.30
GAGE PLANE
(0.36)
8¡Æ
(2.04)
SEATING PLANE
DETAIL A
SCALE: 2:1
Figure 18. 10-Lead, Small Outline Package (SSOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the
warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2008 Fairchild Semiconductor Corporation
FAN7601B • Rev.1.0.2
9
www.fairchildsemi.com
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