MC33164 查看數據表（PDF） - ON Semiconductor

零件编号

产品描述 (功能)

比赛名单

MC33164

Micropower Undervoltage Sensing Circuits

ON Semiconductor 

MC34164, MC33164, NCV33164

PACKAGE DIMENSIONS

TSOP−5

SN SUFFIX

CASE 483−02

ISSUE M

NOTE 5

2X 0.10 T

2X

0.20 T B 5

4

1 23

B

G

A

A

TOP VIEW

D 5X

0.20 C A B

S

M

K

DETAIL Z

C

0.05

H

SIDE VIEW

C

SEATING

PLANE

DETAIL Z

J

END VIEW

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH

THICKNESS. MINIMUM LEAD THICKNESS IS THE

MINIMUM THICKNESS OF BASE MATERIAL.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS, OR GATE BURRS. MOLD

FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT

EXCEED 0.15 PER SIDE. DIMENSION A.

5. OPTIONAL CONSTRUCTION: AN ADDITIONAL

TRIMMED LEAD IS ALLOWED IN THIS LOCATION.

TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2

FROM BODY.

MILLIMETERS

DIM MIN MAX

A 2.85 3.15

B 1.35 1.65

C 0.90 1.10

D 0.25 0.50

G

0.95 BSC

H 0.01 0.10

J 0.10 0.26

K 0.20 0.60

M

0 _ 10 _

S 2.50 3.00

SOLDERING FOOTPRINT*

0.95

0.037

1.9

0.074

2.4

0.094

1.0

0.039

0.7

0.028

ǒ Ǔ SCALE 10:1

mm

inches

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

www.onsemi.com

10

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