R3111Q601B-TR-F 查看數據表（PDF） - RICOH Co.,Ltd.
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R3111Q601B-TR-F Datasheet PDF : 44 Pages
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PACKAGE INFORMATION
PE-SOT-89-0512
POWER DISSIPATION (SOT-89)
This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board.
This specification is based on the measurement at the condition below:
Measurement Conditions
Environment
Board Material
Board Dimensions
Copper Ratio
Through-hole
Standard Land Pattern
Mounting on Board (Wind velocity=0m/s)
Glass cloth epoxy plactic (Double sided)
50mm × 50mm × 1.6mm
Top side : Approx. 10% , Back side : Approx. 100%
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Measurement Result
Power Dissipation
Thermal Resistance
Standard Land Pattern
900mW
θja=(125−25°C)/0.9W=111°C/W
(Topt=25°C,Tjmax=125°C)
Free Air
500mW
200°C/W
1000
50
900
On Board
750
Free Air
500
250
0
0
25
50
75
100 125 150
Ambient Temperature (°C)
Power Dissipation
Measurement Board Pattern
IC Mount Area (Unit : mm)
RECOMMENDED LAND PATTERN (SOT-89)
2.0
45°
1.0
1.0
1.0
1.5
1.5
(Unit : mm)
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