MBRB2515 查看數據表（PDF） - Motorola => Freescale
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MBRB2515
Motorola => Freescale
MBRB2515 Datasheet PDF : 6 Pages
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MBRB2515L/D
™ Designer's Data Sheet
™ SWITCHMODE Power Rectifier
MBRB2515L
OR'ing Function Diode
D2PAK Surface Mount Power Package
The D2PAK Power Rectifier employs the Schottky Barrier principle in a large
metal–to–silicon power diode. State–of–the–art geometry features epitaxial
construction with oxide passivation and metal overlay contact. Ideally suited for
use in low voltage, high frequency switching power supplies, free wheeling
diodes, and polarity protection diodes. These state–of–the–art devices have the
following features:
• Guardring for Stress Protection
• Low Forward Voltage
• 100°C Operating Junction Temperature
• Epoxy Meets UL94, VO at 1/8″
• Guaranteed Reverse Avalanche
1
• Short Heat Sink Tab Manufactured — Not Sheared!
3
• Similar in Size to the Industry Standard TO–220 Package
Mechanical Characteristics
• Case: Epoxy, Molded
• Weight: 1.7 grams (approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering
Purposes: 260°C Max. for 10 Seconds
• Shipped 50 units per plastic tube
• Available in 24 mm Tape and Reel, 800 units per 13″ reel by
adding a “T4” suffix to the part number
• Marking: B2515L
Motorola Preferred Device
SCHOTTKY BARRIER
RECTIFIER
25 AMPERES
15 VOLTS
4
4
1
3
CASE 418B–02
D2PAK
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
15
Volts
VRWM
VR
Average Rectified Forward Current (Rated VR) TC = 90°C
IF(AV)
25
Amps
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz) TC = 100°C
IFRM
30
Amps
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM
150
Amps
Storage Temperature
Operating Junction Temperature
Voltage Rate of Change (Rated VR)
THERMAL CHARACTERISTICS
Tstg
TJ
dv/dt
– 65 to +150
100
10000
°C
°C
V/µs
Thermal Resistance — Junction to Case
— Junction to Ambient (1)
RθJC
RθJA
1.0
°C/W
50
(1) When mounted using minimum recommended pad size on FR–4 board.
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
Designer’s and SWITCHMODE are trademarks of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
Rev 1
©RMeoctotriofilea,rInDce. 1v9ic96e Data
1
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