P0406FC05C(2005) 查看數據表（PDF） - Protek Devices
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P0406FC05C Datasheet PDF : 6 Pages
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APPLICATION INFORMATION
P0406FC3.3C*
thru
P0406FC36C*
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
REQUIREMENTS
Temperature:
TP for Lead-Free (SnAgCu): 260-265°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
TL
TSMAX
TSMIN
05155.R4 3/05
Ramp-up
155°
Ramp-down
TS - Preheat
140°
t 25°C to Peak
30-60 seconds
Ramp-up
Solder Time Ramp-down
15 seconds 15-20 seconds
*U.S. Patent No. Des. “D456,367S”
4
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