Philips Semiconductors
Microwave power transistor
handbook, full pagewidth
30
Product specification
BLS2731-110
30
40
input
L4
L6
L2
L1
L3
L5
L8
L7
L9
C3
L11
C2
RC
L10
C1
L13
L14
output
L12
MGM540
Dimensions in mm.
The components are located on one side of the copper-clad printed-circuit board, the other side is unetched and serves as a ground plane.
Earth connections from the component side to the ground plane are made by through metallization.
Fig.6 Component layout for 2.7 to 3.1 GHz class-C test circuit.
1998 Jan 30
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