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84052IBZ 查看數據表(PDF) - Renesas Electronics

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产品描述 (功能)
比赛名单
84052IBZ Datasheet PDF : 19 Pages
First Prev 11 12 13 14 15 16 17 18 19
ISL84051, ISL84052, ISL84053
Package Outline Drawing
M16.173
16 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 5/10
A
13
5.00 ±0.10
16
9
6.40
4.40 ±0.10
2
3
PIN #1
I.D. MARK
0.20 C B A 1
8
0.65
B
TOP VIEW
SEE DETAIL "X"
0.09-0.20
END VIEW
H
C
SEATING
PLANE
0.10 C
- 0.05
1.20 MAX
0.90 +0.15/-0.10
0.25 +0.05/-0.06 5
0.10 M C B A
SIDE VIEW
0.05 MIN
0.15 MAX
1.00 REF
GAUGE
PLANE
0.25
DETAIL "X"
0°-8°
0.60 ±0.15
(5.65)
(1.45)
(0.65 TYP)
(0.35 TYP)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side.
2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
5. Dimension does not include dambar protrusion. Allowable protrusion
shall be 0.08mm total in excess of dimension at maximum material
condition. Minimum space between protrusion and adjacent lead
is 0.07mm.
6. Dimension in ( ) are for reference only.
7. Conforms to JEDEC MO-153.
FN6047 Rev.10.00
May 16, 2011
Page 18 of 19

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