TSOP5230 查看數據表（PDF） - Vishay Semiconductors
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TSOP5230 Datasheet PDF : 8 Pages
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TSOP52..
Vishay Telefunken
Operating Instructions
Reflow Soldering
D Reflow soldering must be done within 48 hours
stored under max. 30°C, 80% RH after opening
envelop
D Recommended soldering paste
(composition: SN 63%, Pb 37%)
Melting temperature 178 to 192°C
D Apply solder paste to the specified soldering
pads, by using a dispenser or by screen printing.
D Recommended thickness of metal mask is 0.2 mm
for screen printing.
D The recommended reflow furnace is a
combinationtype with upper and lower heaters.
D Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown below. Excercise extreme care to
keep the maximum temperature below 230_C. The
following temperature profile means the tempera–
ture at the device surface. Since temperature differ–
ence occurs between the work and the surface of
the circuit board depending on the pes of circuit
board or reflow furnace, the operating conditions
should be verified prior to start of operation.
D Handling after reflow should be done only after the
work surface has been cooled off.
Manual Soldering
D Use the 6/4 solder or the solder containing silver.
D Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300_C.
D Finish soldering within three seconds.
D Handle products only after the temperature is
cooled off.
Cleaning
D Perform cleaning after soldering strictly in
conformance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol).
Commercially available grades (industrial
use) should be used.
Demineralized or distilled water having a
resistivity of not less than 500 mW
corresponding to a conductivity of 2 mS/m.
D Temperature and time: 30 seconds under the
temperature below 50_C or 3 minutes below 30_C.
D Ultrasonic cleaning: Below 20 W.
300
max. 240 °C
250
ca. 230 °C
10 s
94 8625
215 °C
200
150
100
50
0
2–4 K / s
50
max. 160 °C
max. 40 s
90 – 120 s
full line : typical
dotted line : process limits
Lead Temperature
100
150
200
250
Time ( s )
www.vishay.com
6 (8)
Document Number 82154
Rev. 1, 08-Mar-01
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