HFM301-BS 查看數據表（PDF） - Formosa Technology

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HFM301-BS

Chip High Effciency Rectifiers

Formosa Technology 

Chip High Effciency Rectifiers

Formosa MS

HFM301-BS THRU HFM307-BS

Reel packing

PACKAGE

REEL SIZE

SMB-S

13"

REEL

(pcs)

COMPONENT

SPACING

(m/m)

4,000

8.0

BOX

(pcs)

INNER

BOX

(m/m)

8,000 337*337*37

REEL

DIA,

(m/m)

330

CARTON

SIZE

(m/m)

350*330*360

CARTON

(pcs)

64,000

APPROX.

GROSS WEIGHT

(kg)

16.9

Suggested thermal profiles for soldering processes

1.Storage environment: Temperature=5oC~40oC Humidity=55%±25%

2.Reflow soldering of surface-mount devices

Tp

TP

Ramp-up

TL

TL

Tsmax

Critical Zone

TL to TP

Ts m i n

tS

Preheat

Ramp-down

25

t25oC to Peak

3.Reflow soldering

Time

Profile Feature

Average ramp-up rate(TL to TP)

Preheat

-Temperature Min(Tsmin)

-Temperature Max(Tsmax)

-Time(min to max)(ts)

Tsmax to TL

-Ramp-upRate

Time maintained above:

-Temperature(TL)

-Time(tL)

Peak Temperature(TP)

Time within 5oC of actual Peak

Temperature(tP)

Ramp-down Rate

Time 25oC to Peak Temperature

Soldering Condition

<3oC/sec

150oC

200oC

60~120sec

<3oC/sec

217oC

60~260sec

255oC-0/+5oC

10~30sec

<6oC/sec

<6minutes

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Page 6

Document ID Issued Date

DS-121322 2013/01/03

Revised Date Revision

-

A

Page.

7

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